SURFACE STRUCTURE FOR BASE MATERIAL TO BE PRINTED AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

APP PUB NO 20180304660A1
SERIAL NO

15767937

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Abstract

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In the present invention, an uneven structure is formed on a surface of a base material to be printed to which ink is applied, and the pitch, the shape in plan view, and the depth of recesses in the uneven structure are determined on the basis of the physical properties (specific weight, viscosity, and contact angle) of ink to be used, in accordance with a printing pattern and a required printing precision. The amount of ink filling the recesses is thereby controlled, and high-precision is enabled at low cost without changing the printing process itself.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HOKARI, Ryohei Tsukuba-shi, JP 5 1
KURIHARA, Kazuma Tsukuba-shi, JP 16 100
TAKADA, Naoki Tsukuba-shi, JP 124 878

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