METHOD AND APPARATUS FOR BUILDING A 3D OJBECT FROM LAYERS OF PRE-STRIPPED SUBSTRATE
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United States of America Patent
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Issued Date -
Oct 18, 2018
app pub date -
Aug 26, 2015
filing date -
Aug 26, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate-waste portion(s) from the substrate-retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described—any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HIGHCON SYSTEMS LTD | 8122503 YAVNE |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
BEN-DAVID, David | Rehovot, IL | 43 | 54 |
IRENI, Eli | Raanana, IL | 5 | 7 |
KARP, Michael | Petah Tikva, IL | 21 | 165 |
ROTTMAN, Claudio | Modiin, IL | 27 | 742 |
ZIMMER, Michael | Beit Elazari, IL | 33 | 136 |
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