BINDING PROCESSING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20180292779A1
SERIAL NO

15786022

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A binding processing device includes: a needle binding unit that forms a needle binding portion that binds a paper bundle using a needle; a needleless binding unit that forms a needleless binding portion that binds the paper bundle without using a needle; and a plurality of exit rolls that exit the bound paper bundle. A distance between the needleless binding portion and a center of the plurality of exit rolls is equal to or longer than a distance between the needle binding portion and the center.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM BUSINESS INNOVATION CORPTOKYO

International Classification(s)

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  • 2017 Application Filing Year
  • B65H Class
  • 1541 Applications Filed
  • 1205 Patents Issued To-Date
  • 78.20 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AWANO, Hiroaki Yokohama-shi, JP 67 346
HARADA, Katsumi Yokohama-shi, JP 48 166
MAKITA, Takuya Yokohama-shi, JP 34 57
MATSUMOTO, Masashi Yokohama-shi, JP 116 619
OGINO, Takashi Ebina-shi, JP 125 1277
TSUTSUMI, Kojiro Yokohama-shi, JP 68 429
YUKAWA, Toshiyasu Yokohama-shi, JP 26 32

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Patent Citation Ranking

  • 1 Citation Count
  • B65H Class
  • 41.16 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4776284571101 - 1011 - 2021 - 3041 - 5051 - 60050100150200250300350400450500550600650700

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