Apparatus and method for RF isolation in a packaged integrated circuit
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United States of America Patent
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Nov 3, 2020
Grant Date -
Oct 4, 2018
app pub date -
Mar 28, 2018
filing date -
Mar 31, 2017
priority date (Note) -
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Abstract
Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an “RF group”) and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.
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