Sheet for semiconductor processing

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United States of America Patent

PATENT NO 10825711
APP PUB NO 20180286736A1
SERIAL NO

15764377

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Abstract

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The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATION23-23 HONCHO ITABASHI-KU TOKYO 1730001 ?1730001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akutsu, Takashi Saitama, JP 77 1252
Bandou, Sayaka Tokorozawa, JP 1 1
Kakiuchi, Yasuhiko Warabi, JP 2 1
Komasu, Yuichiro Kita, JP 1 1

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