Method for producing porous copper foil and porous copper foil produced by the same
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United States of America Patent
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Jun 8, 2021
Grant Date -
Oct 4, 2018
app pub date -
Mar 18, 2018
filing date -
Mar 30, 2017
priority date (Note) -
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Abstract
Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
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