Natural convection cooling for power electronics systems having discrete power dissipation components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10130009
APP PUB NO 20180270987A1
SERIAL NO

15459187

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Abstract

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A power electronics based system using natural, convection cooling, includes an enclosure housing a plurality of discrete components distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction. There is a heat exchanger adjacent to the enclosure, including an inlet port and an outlet port in fluid communication with the enclosure. The heat exchanger has a vertical cooling average center at a second height. There is a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete components. The discrete components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger.

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Patent Owner(s)

Patent OwnerAddress
AMERICAN SUPERCONDUCTOR CORPORATIONTWO TECHNOLOGY DRIVE WESTBOROUGH MA 01581

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brubaker, John Milwaukee, US 3 81
Flannery, Patrick Madison, US 1 4
Hansen, Peter Holden, US 132 2619
Winn, Peter Shrewsbury, US 2 13
Yuan, Jie South Grafton, US 109 4416

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