Importance

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Abstract

A module substrate includes a surface layer to which a rectangular waveguide structure having a waveguide aperture is to be connected; metal layers stacked with a dielectric layer between each pair thereof and including a first metal layer that includes a transmission line and a coupling element at a portion of the transmission line and a second metal layer positioned further than the first metal layer from the rectangular waveguide structure; and vias connecting the adjacent metal layers. The surface layer has a first opening facing the waveguide aperture. The first opening surrounds the coupling element in plan view from the surface layer. A dielectric layer region surrounded by some of the vias is formed within a projection area of the first opening between the first and second metal layers. The region has a size smaller than the waveguide aperture in the plan view.

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First Claim