METHOD OF APPLYING VERTEX BASED CORRECTIONS TO A SEMICONDUCTOR DESIGN

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United States of America Patent

APP PUB NO 20180267399A1
SERIAL NO

15534921

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Abstract

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A method of geometry corrections to properly transfer semiconductor designs on a wafer or a mask in nanometer scale processes is provided. In contrast with some prior art techniques, geometry corrections and possibly dose corrections are applied before fracturing. Unlike edge based corrections, where the edges are displaced in parallel, the displacements applied to generated geometry corrections do not preserve parallelism of the edges, which is specifically well suited for free form designs. A seed design is generated from the target design. Vertices connecting segments are placed along the seed design contour. Correction sites are placed on the segments. Displacement vectors are applied to the vertices. A simulated contour is generated and compared to the contour of the target design. The process is iterated until a match criteria between simulated and target design (or another stop criteria) is reached.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MILLEQUANT, Mathieu GRENOBLE, FR 1 10
QUAGLIO, Thomas GRENOBLE, FR 4 20
TIPHINE, Charles ECHIROLLES, FR 4 20

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