METHOD FOR CUTTING GLASS
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United States of America Patent
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Sep 20, 2018
app pub date -
Jun 28, 2017
filing date -
Jun 28, 2017
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Abstract
A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.
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