POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD

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United States of America Patent

APP PUB NO 20180258319A1
SERIAL NO

15758399

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Abstract

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A polishing liquid comprising a liquid medium, an abrasive grain and a polymer, wherein the polymer includes a first molecular chain having a functional group directly bonded thereto, and a second molecular chain branched from the first molecular chain, and the functional group is at least one selected from the group consisting of a carboxyl group, a carboxylic acid salt group, a hydroxyl group, a sulfo group and a sulfonic acid salt group.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 ?1057325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKUTSU, Toshiaki Chiyoda-ku, Tokyo, JP 21 222
AOKI, Masako Chiyoda-ku, Tokyo, JP 4 2
FUKASAWA, Masato Chiyoda-ku, Tokyo, JP 31 333
IWANO, Tomohiro Chiyoda-ku, Tokyo, JP 56 332
MINAMI, Hisataka Chiyoda-ku, Tokyo, JP 28 207
YAMASHITA, Tetsuro Chiyoda-ku, Tokyo, JP 14 75

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