Flexible conductive bonding

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United States of America Patent

PATENT NO 10355371
APP PUB NO 20180254566A1
SERIAL NO

15449808

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Abstract

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Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

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Patent Owner(s)

Patent OwnerAddress
MICROSOFT TECHNOLOGY LICENSING LLCONE MICROSOFT WAY REDMOND WA 98052

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dickey, Michael David Redmond, US 11 95
Fassler, Andrew Lewis Seattle, US 2 6
Holbery, James David Bellevue, US 46 287
Ladd, Collin Alexander Sammamish, US 9 10
Ma, Siyuan Bothell, US 51 277
Ribeiro, Flavio Protasio Bellevue, US 22 347

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