Millimeter wave semiconductor apparatus including a microstrip to fin line interface to a waveguide member
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 6, 2018
app pub date -
Aug 18, 2016
filing date -
Aug 18, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A millimeter wave semiconductor apparatus includes: a module substrate including the millimeter wave semiconductor chip mounted thereon; and a waveguide tube member constituting a package of the chip and the waveguide tube by including the waveguide tube and supporting the module substrate, the module substrate includes: a base member; a line pattern including a microstrip line portion, a fin line portion, and an interface portion formed on one of surfaces of the base member; a ground pattern formed on the other surface of the base member; and a cavity defined by a hole formed through the base member at a center portion thereof and a surface of the ground pattern on a side where the line pattern is formed as a bottom surface for mounting the chip on the bottom surface thereof, and the microstrip line portion and the chip are wire-bonded at the substantially same level.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully