ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Sep 6, 2018
app pub date -
Jan 26, 2016
filing date -
Jan 26, 2016
priority date (Note) -
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Abstract
The present invention is to provide an electronic device which is capable of suppressing deformation due to a restoring force of a bump electrode. The electronic device includes a pressure chamber forming substrate (29) which is provided with a piezoelectric element (32) causing a driving region (a1) to be deformed on the driving region (a1) capable of being bent and deformed, a sealing plate (33) which is disposed at intervals with respect to the pressure chamber forming substrate (29) in a state of interposing a bump electrode (40) having elasticity therebetween, and an adhesive (43) which bonds the pressure chamber forming substrate (29) and the sealing plate (33) in a state of maintaining the interval, and the adhesive (43) is provided on at least a region between the bump electrode (40) and the driving region (a1).
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