EPITAXIAL SUBSTRATE FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR ELEMENT, AND MANUFACTURING METHOD FOR EPITAXIAL SUBSTRATES FOR SEMICONDUCTOR ELEMENTS

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United States of America Patent

APP PUB NO 20180247817A1
SERIAL NO

15965210

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Abstract

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Provided is an epitaxial substrate for semiconductor elements which suppresses an occurrence of current collapse. The epitaxial substrate for the semiconductor elements includes: a semi-insulating free-standing substrate formed of GaN being doped with Zn; a buffer layer being adjacent to the free-standing substrate; a channel layer being adjacent to the buffer layer; and a barrier layer being provided on an opposite side of the buffer layer with the channel layer therebetween, wherein the buffer layer is a diffusion suppressing layer formed of AlpGa1-pN (0.7≤p≤1) and suppresses diffusion of Zn from the free-standing substrate into the channel layer.

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Patent OwnerAddress
NGK INSULATORS LTDJAPAN'S AICHI AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichimura, Mikiya Ichinomiya-shi, JP 44 220
Kuraoka, Yoshitaka Okazaki-shi, JP 43 127
Maehara, Sota Nagoya-shi, JP 21 73

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