SILICON NITRIDE SINTERED BODY WITH HIGH THERMAL CONDUCTIVITY AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Aug 23, 2018
app pub date -
Aug 17, 2016
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Aug 17, 2015
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Embodiments relate to a method for manufacturing a silicon nitride sintered body with high thermal conductivity, which includes the steps of: a) obtaining a slurry by mixing a silicon nitride powder and a non-oxide based sintering aid; b) obtaining a mixed powder by drying the slurry; c) forming a compact by pressurizing the mixed powder; and d) sintering the compact.
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