Photosensitive resin composition for relief printing original plate and relief printing original plate obtained therefrom
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United States of America Patent
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Oct 20, 2020
Grant Date -
Aug 23, 2018
app pub date -
Aug 2, 2016
filing date -
Sep 28, 2015
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Abstract
The present invention provides a photosensitive resin composition for a relief printing original plate which can achieve both of a printing reproducibility of gradation of a highlight part and a printing durability, and can further achieve a low plate surface tackiness. A photosensitive resin composition for a relief printing original plate containing water-soluble or water-dispersible polyamide, a photopolymerizable unsaturated compound and a photopolymerization initiator as essential ingredients, characterized in that a total of a content of an alicyclic structural unit obtained from diamine and a content of an alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 30 to 90 molar %, and the content of the alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 20 molar % or more.
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