HYBRID COMPUTING MODULE
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United States of America Patent
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Issued Date -
Aug 9, 2018
app pub date -
Dec 18, 2017
filing date -
Dec 18, 2017
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A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
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