APPLYING EQUALIZED PLASMA COUPLING DESIGN FOR MURA FREE SUSCEPTOR
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United States of America Patent
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Issued Date -
Aug 2, 2018
app pub date -
Jan 30, 2018
filing date -
Feb 2, 2017
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Abstract
A method and apparatus for equalized plasma coupling is provided herein. Discontinuity marks, also known as golf tee mura, are eliminated or minimized by biasing or grounding lift pins disposed in openings towards the center of a substrate support. To prevent shorting between a biased or grounded lift pin and the substrate support, lift pins are electrically isolated from the substrate support. The electrical isolation of the lift pin includes coating the lift pins with an electrically insulating material or lining a respective substrate support opening with an electrically insulating material.
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