HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING HEAT DISSIPATION CIRCUIT BOARD
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United States of America Patent
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app pub date -
Jul 29, 2015
filing date -
Jul 30, 2014
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Abstract
A heat dissipation circuit board includes a printed circuit board including an insulating film and a conductive pattern that is formed on a front-surface side of the insulating film and includes at least one land part and a wiring part connected to the at least one land part; and at least one electronic component mounted on a front-surface side of the at least one land part. In the heat dissipation circuit board, the printed circuit board includes a recess on a side opposite to a side on which the at least one electronic component is mounted, the recess being in at least a portion of a projection region of the at least one land part, the recess extending to the conductive pattern, and includes a thermally conductive adhesive layer filling the recess. Furthermore, in the heat dissipation circuit board, the insulating film remains, in plan view, in a region including, in the at least one land part, at least a portion of a connecting boundary to the wiring part or at least a portion of a peripheral edge facing the connecting boundary.
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