LED package structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10727383
APP PUB NO 20180190884A1
SERIAL NO

15819599

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Abstract

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An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.

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Patent Owner(s)

Patent OwnerAddress
LITE-ON TECHNOLOGY CORPORATION22F NO 392 RUEY KUANG RD NEIHU TAIPEI 11492
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO LTDCHANGZHOU CITY JIANGSU PROVINCE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yu-Yu Kaohsiung, TW 17 91
Chen, Yi-Hsuan New Taipei, TW 41 67
Lin, Chen-Hsiu New Taipei, TW 94 814
Yen, Shih-Chiang Taipei, TW 6 31

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