Molded resin-equipped electric wire and molded resin-equipped electric wire production method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10065342
APP PUB NO 20180186036A1
SERIAL NO

15740105

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

When forming molded resin on a terminal-equipped conductive wire, cases where resin inside the mold for insert-molding leaks out from the mold are suppressed. A smooth portion having a smooth outer circumferential surface is formed in a conductive wire of a terminal-equipped conductive wire (smooth portion formation step (S2)). Furthermore, a molded resin member that covers the terminal connection portion is formed in a state where the terminal connection portion provided is inserted into an insert-molding mold, and a portion of the conductive wire that extends from a metal terminal is exposed to the outside through an opening portion of the mold (insert-molding step (S3)). The outer shape of the smooth portion is a shape that corresponds to the opening shape of the opening portion of the mold. In the insert-molding step (S3), the interior of the mold is filled with a resin in a state where the inner circumferential surface of the opening portion of the mold is in contact with the outer circumferential surface of the smooth portion.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SUMITOMO WIRING SYSTEMS LTD1-14 NISHISUEHIRO-CHO YOKKAICHI MIE 510-8503
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA
AUTONETWORKS TECHNOLOGIES LTDMIE JAPAN MIE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukumoto, Kouji Mie, JP 21 111
Hashimoto, Daisuke Mie, JP 216 2475
Hirooka, Toshiya Mie, JP 16 51
Hirose, Mitsuru Mie, JP 14 89
Horio, Hitoshi Mie, JP 5 5
Kim, Jisung Mie, JP 26 62
Miyamoto, Kenji Mie, JP 161 980

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Mar 4, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 4, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00