Hybrid-type power module having dual-sided cooling

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United States of America Patent

PATENT NO 10211193
APP PUB NO 20180175010A1
SERIAL NO

15612304

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Abstract

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A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

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Patent Owner(s)

Patent OwnerAddress
KIA MOTORS CORPORATION12 HEOLLEUNG-RO SEOCHO-GU SEOUL 06797
HYUNDAI MOTOR COMPANYSEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Woo Yong Seoul, KR 13 65
Lee, Hyun Koo Seoul, KR 27 109
Shin, Sang Cheol Gyeonggi-do, KR 82 197

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