Method of manufacturing a semiconductor device using a mounting apparatus
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United States of America Patent
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Dec 4, 2018
Grant Date -
Jun 21, 2018
app pub date -
Feb 19, 2018
filing date -
Oct 2, 2013
priority date (Note) -
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Abstract
A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.
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