Process for the electrolytic polishing of a metallic substrate
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United States of America Patent
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Nov 2, 2021
Grant Date -
Jun 21, 2018
app pub date -
Dec 14, 2017
filing date -
Dec 21, 2016
priority date (Note) -
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Abstract
The present disclosure is directed a process for the electrolytic polishing of a metallic substrate, including the steps of (i) providing an electrolyte in an electrolytic cell having at least one electrode, (ii) disposing a metallic substrate as an anode in the electrolytic cell, (iii) applying a current at a voltage of 270 to 315 V from a power source between the at least one electrode and the metallic substrate, and (iv) immersing the metallic substrate in the electrolyte, wherein the electrolyte includes at least one acid compound, at least one fluoride compound, and at least one complexing agent.
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