Thermally conductive resin composition
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United States of America Patent
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Jun 30, 2016
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Jul 2, 2015
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The present invention relates to a thermally conductive resin composition containing a resin (A) having a melting point of 40 to 100° C. and an inorganic filler (B), wherein the resin (A) has a weight loss of less than 10% when the resin (A) is stored at 150° C. for 100 hours under an atmosphere. The thermally conductive resin composition of the present invention is suitably used for a thermal interface material (TIM), particularly TIM for a semiconductor module.
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