FLEXIBLE CIRCUIT BOARD, ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY APPARATUS

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United States of America Patent

SERIAL NO

15508990

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Abstract

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In accordance with various embodiments of the disclosed subject matter, an array substrate, a fabricating method thereof, and a related display apparatus are provided. The array substrate comprises: a main substrate including a central display region and a peripheral wiring region, wherein a plurality of conducting wire terminals are disposed in the peripheral wiring region: and at least one flexible circuit board bonded on the peripheral wiring region of the main substrate: wherein each flexible circuit board includes a base substrate made of a soft cloth material and a flexible driving circuit structure formed on the base substrate; the flexible driving circuit structure of each flexible circuit board further includes a plurality of connecting terminals that are correspondently electrically connected with at least a pan of the plurality of conducting wire terminals of the main substrate.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTDNO 10 JIUXIANQIAO RD CHAOYANG DISTRICT BEIJING 100015 100015

International Classification(s)

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  • 2016 Application Filing Year
  • H05K Class
  • 5695 Applications Filed
  • 4316 Patents Issued To-Date
  • 75.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LU, Jiaoming Beijing, CN 12 10
ZHAO, Weili Beijing, CN 54 179

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges45012521444514421101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 90010020030040050060070080090010001100120013001400

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