Structure and Method of Making Circuitized Substrate Assembly
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United States of America Patent
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Dec 6, 2016
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Dec 6, 2016
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A structure and method for a circuitized substrate assembly that provides interface capability with high-density I/O devices, such as semiconductor devices, said structure and method providing enhanced capability for direct chip attach technology and for device interface board that perform functional and operational testing capability for semiconductor devices having an interconnect pitch down to 50 um or smaller.
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