THERMAL SIMULATION SYSTEM

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United States of America Patent

SERIAL NO

15832699

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Abstract

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A thermal simulation system adapted to establish a test environment for a thermal test is provided. The thermal simulation system includes a communication element, a controllable loading element, a plurality of connectors, and a controller. The communication element is configured to receive at least one of a heating control signal, a fan control signal, and a loading control signal from an external electronic device. The controllable loading element is configured to provide a loading. The connectors are configured to connect a heating element and a fan. The controller is configured to control a heat energy generated by the heating element according to the heating control signal, control a fan speed of the fan according to the fan control signal, and control a loading value of the loading provided by the controllable loading element according to the loading control signal.

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Patent Owner(s)

Patent OwnerAddress
COMPAL ELECTRONICS INCTAIPEI CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kung, Te-Ming Taipei City, TW 15 30
Lai, Wen-Shyan Taipei City, TW 4 6
Tu, Chang-Yu Taipei City, TW 4 6
Wu, Tung-Hua Taipei City, TW 1 1

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