Laser apparatus for cutting brittle material
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United States of America Patent
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Jun 2, 2020
Grant Date -
May 17, 2018
app pub date -
Nov 15, 2016
filing date -
Nov 15, 2016
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Abstract
An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.
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