Component mounter and mounting board manufacturing method
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United States of America Patent
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Oct 20, 2020
Grant Date -
May 10, 2018
app pub date -
Oct 17, 2017
filing date -
Nov 4, 2016
priority date (Note) -
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Abstract
In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.
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