SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Apr 19, 2016
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Apr 20, 2015
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Disclosed is a substrate processing apparatus comprising: a chamber which provides a substrate processing space; a process gas supply line which is for supplying a process gas into the chamber; a first diffusion plate which has formed on an edge portion thereof an injection hole for injecting the process gas; a substrate support which faces the first diffusion plate and is for supporting a substrate; a second diffusion plate which is provided between the first diffusion plate and the substrate support and has formed thereon a plurality of distribution holes; and a plasma generation unit which is for forming plasma in the space between the first diffusion plate and the second diffusion plate.
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