ACIDIC COPPER PLATING SOLUTION, ACIDIC COPPER PLATED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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Nov 21, 2016
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Nov 26, 2015
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The acidic copper plating solution of the present invention includes: a first additive including a cationic polymer; at least one second additive selected from the group consisting of 2-mercapto-5-benzimidazole sulfonic acid, sodium 2-mercapto-5-benzimidazole sulfonate dihydrate, ethylene thiourea, and partial 2-mercapto-5-benzimidazole sulfonate of poly(diallyldimethylammonium chloride); and a third additive including a sulfur atom-containing organic compound, the acidic copper plating solution having a copper concentration of 10 to 60 g/L and a sulfuric acid concentration of 10 to 200 g/L, and containing chloride ions of in an amount of 90 mg/L or less. The acidic copper plating solution is capable of producing an acidic copper plated product having low thermal expansion property.
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