Integrated Circuit Including Buried Cavity and Manufacturing Method
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United States of America Patent
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Oct 17, 2017
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Oct 18, 2016
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In accordance with an embodiment of an integrated circuit, a cavity is buried in a semiconductor body below a first surface of the semiconductor body. An active area portion of the semiconductor body is arranged between the first surface and the cavity. The integrated circuit further includes a trench isolation structure configured to provide a lateral electric isolation of the active area portion.
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