PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN
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United States of America Patent
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Oct 14, 2016
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Oct 14, 2016
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A method includes applying flux solution during a soldering process. Metal ions are dissolved into the flux solution as a result of the soldering process. The method also includes rinsing the flux solution with a first rinse solution. The first rinse solution includes organic and/or sulfur species, and the organic and/or sulfur species stabilize the metal ions that are dissolved in the flux solution.
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