Light emitting diode component
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United States of America Patent
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Jun 4, 2019
Grant Date -
Nov 6, 2014
app pub date -
May 3, 2013
filing date -
Aug 30, 2002
priority date (Note) -
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Abstract
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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