ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME

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United States of America Patent

SERIAL NO

15552282

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Abstract

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To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190° C., after light sintering.

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Patent Owner(s)

Patent OwnerAddress
DOWA ELECTRONICS MATERIALS CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJITA, Hidefumi Tokyo, JP 18 99
ITOH, Daisuke Tokyo, JP 49 560
KANEDA, Shuji Tokyo, JP 8 61

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