Method and machine for examining wafers
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United States of America Patent
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Nov 17, 2020
Grant Date -
Mar 15, 2018
app pub date -
Sep 18, 2017
filing date -
Feb 13, 2009
priority date (Note) -
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Abstract
Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.
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