Micro sensor package
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United States of America Patent
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Jul 7, 2020
Grant Date -
Mar 15, 2018
app pub date -
Sep 12, 2017
filing date -
Sep 13, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
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