Micro sensor package and manufacturing method of micro sensor package

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United States of America Patent

PATENT NO 10634634
APP PUB NO 20180073999A1
SERIAL NO

15702673

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Abstract

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Disclosed is a microsensor package. Particularly, disclosed is a microsensor package, in which a sensing chip is packaged by using PCBs stacked on top of one another, whereby the thickness of the package slim can be kept slim, and at the same time, it can be manufactured at a low cost and can be easily manufactured.

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Patent Owner(s)

Patent OwnerAddress
POINT ENGINEERING CO LTD89 ASANVALLEY-RO DUNPO-MYEON ASAN-SI CHUNGCHEONGNAM-DO 31409

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Bum Mo Suwon, KR 162 241
Byun, Sung Hyun Hwaseong, KR 78 102
Park, Seung Ho Hwaseong, KR 185 355

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