Laser microdissection apparatus, analysis apparatus including laser microdissection apparatus, sample collection method, and device used in laser microdissection apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Apr 6, 2016
filing date -
Apr 6, 2015
priority date (Note) -
Published
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
The present invention addresses the problem of providing a laser microdissection apparatus having good operational efficiency. The laser microdissection apparatus, comprising sample movement means capable of retaining a slide, device movement means on which a device having a thermofusible film for transferring a sample can be mounted, a laser irradiation part for irradiating the sample with a dissection laser light, storage means for correlating and storing positional coordinates of the sample in the location irradiated by the dissection laser light and positional coordinates of the thermofusible film in a location where the collected sample is adhered, and a movement means drive control part for controlling driving of the sample movement means and the device movement means on the basis of the positional coordinates of the sample and the thermofusible film. The dissection laser light is radiated through the device onto the sample from below the device.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM | 1 FURO-CHO CHIKUSA-KU NAGOYA-SHI AICHI-KEN 464-8601 |
International Classification(s)

- 2016 Application Filing Year
- H01J Class
- 2255 Applications Filed
- 1758 Patents Issued To-Date
- 77.97 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Sawada, Makoto | Aichi, JP | 109 | 555 |
# of filed Patents : 109 Total Citations : 555 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 1 Citation Count
- H01J Class
- 50.32 % this patent is cited more than
- 5 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 21, 2027 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 21, 2031 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
