Bonding process and system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10800112
APP PUB NO 20180072003A1
SERIAL NO

15702068

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Abstract

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A system and process for bonding involves a pocket made into one article is used to secure that article to another using a flowable, curable material (e.g., resin) which during saturation enters through a passageway and at least partially fills the void. When the article is cured, the article is bonded to another article to which resin has also been applied since the void (now containing cured material) is larger than the passageway.

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Patent Owner(s)

Patent OwnerAddress
TEXTRON AVIATION RHODE ISLAND INC40 WESTMINSTER STREET PROVIDENCE RI 02903

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gintert, Lawrence Arthur Andover, US 5 5
Kendrick, Phillip Anthony Wichita, US 5 8
McKown, Mike Preston Wichita, US 2 0
Skidmore, Herbert Lee Viola, US 4 2

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