THERMOPLASTIC RESIN FILM LAMINATE AND MOLDED ARTICLE COMPRISING THERMOPLASTIC RESIN FILM LAMINATE

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United States of America Patent

SERIAL NO

15559184

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Abstract

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Provided is a thermoplastic resin film laminate, which is obtained by ultrasonic welding of a thermoplastic resin film and a thermoplastic resin molded article, and which has high welding strength and excellent appearance with less welding marks. The above-described problem is solved by a thermoplastic resin film laminate which is obtained by bonding, by ultrasonic welding, a thermoplastic resin film having a thickness of 0.4 mm or less and a welding margin of a thermoplastic resin molded article having the welding margin and having a thickness of 0.5 mm or more, and wherein the height of the welding margin is 75-125% of the thickness of the thermoplastic resin film.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8324
MGC FILSHEET CO LTD4-2242 MIKAJIMA TOKOROZAWA-CITY SAITAMA 359-1164

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KUROKAWA, Haruhiko Kanagawa, JP 14 54

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