Substrate processing method and substrate processing device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 2, 2020
Grant Date -
Mar 15, 2018
app pub date -
Feb 25, 2016
filing date -
Mar 24, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In order to solve the problem of satisfactorily removing a resist from the surface of a substrate, the present invention is a substrate processing device (1) having a spin chuck (5) and an SPM feed unit (6) for feeding SPM to the substrate (W) held by the spin chuck (5), wherein the SPM feed unit (6) includes a mixing unit (30) for mixing an aqueous hydrogen peroxide solution and hydrofluoric acid and producing a liquid mixture of hydrogen peroxide water and hydrofluoric acid, and an HF-mixed SPM production unit (14) for mixing the liquid mixture and sulfuric acid and producing HF-mixed SPM.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SCREEN HOLDINGS CO LTD | JAPAN KYOTO KYOTO HORIKAWADORI BEIJING AREA WITHIN THE TEMPLE 4 CHOME GOD KITAMACHI 1 GA 1 KYOTO-SHI KYOTO |
International Classification(s)

- 2016 Application Filing Year
- C09K Class
- 3076 Applications Filed
- 2094 Patents Issued To-Date
- 68.08 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Akizuki, Yusuke | Kyoto, JP | 5 | 3 |
# of filed Patents : 5 Total Citations : 3 |
Cited Art Landscape
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Patent Citation Ranking
- 1 Citation Count
- C09K Class
- 50.14 % this patent is cited more than
- 5 Age
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- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 2, 2027 |
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Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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