Laser processing method and laser processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 6, 2020
Grant Date -
Mar 8, 2018
app pub date -
Nov 9, 2017
filing date -
Sep 13, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B28D:WORKING STONE OR STONE-LIKE MATERIALS
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C03B:MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR ....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
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