ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Sep 6, 2017
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Sep 7, 2016
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The present disclosure provides an electronic package and a method for fabricating the same. The method including: connecting a first carrier structure with an electronic component via a bonding layer formed thereon; stacking the first carrier structure on a second carrier structure via a plurality of conductive elements; and electrically connecting the electronic component to the second carrier structure to thereby maintain and secure the distance between the first and second carrier structures.
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