Thermal dissipation module
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United States of America Patent
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Apr 28, 2020
Grant Date -
Mar 8, 2018
app pub date -
Oct 30, 2017
filing date -
Sep 16, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
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