Method of manufacturing a cover member suitable for a fingerprint sensor
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United States of America Patent
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Jun 9, 2020
Grant Date -
Mar 8, 2018
app pub date -
Sep 1, 2017
filing date -
Sep 2, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A plurality of molded cover members are manufactured by first singulating a single sheet of cover material, such as glass, into a plurality of separate, discrete cover members, placing the cover members in spaced-apart positions on a releaseable carrier, and applying a molded material to the perimeter of each cover member. The molded material can be applied by a blanket molding technique whereby gaps between adjacent cover members are filled, and then the cover members are singulated, leaving a portion of the cover material on the perimeter of each cover member, and then the singulated, molded cover members are released from the releasable carrier. Alternatively, the molded material is applied by a patterned molding technique whereby molding material is applied to the perimeter of each cover member without fully filling the gaps between adjacent cover members, and then the molded cover members are released from the releasable carrier.
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