Power chip and bridge circuit
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United States of America Patent
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Nov 3, 2020
Grant Date -
Mar 1, 2018
app pub date -
Jun 5, 2017
filing date -
Aug 26, 2016
priority date (Note) -
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Abstract
A power chip and a bridge circuit are disclosed in the present disclosure. The power chip includes a metal region and a wafer region, wherein the power chip further includes: a first power switch, formed in the wafer region; and a second power switch, formed in the wafer region, wherein the first and second power switches constitute an upper bridge arm and a lower bridge arm of a bridge circuit, respectively. At least one of the upper bridge arm and the lower bridge arm includes two or more power switches which are connected in parallel with each other, and the first and second power switches are arranged alternatively along at least one dimension direction.
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