Method for manufacturing light emitting element
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United States of America Patent
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Oct 13, 2020
Grant Date -
Mar 1, 2018
app pub date -
Aug 30, 2017
filing date -
Aug 31, 2016
priority date (Note) -
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Abstract
A method for manufacturing a light emitting element includes: forming a semiconductor structure on a first substrate; providing a second substrate configured to be bonded above a side of the semiconductor structure opposite the first substrate; forming a metal layer above at least one of (i) a side of the semiconductor structure opposite the first substrate, and/or (ii) a side of the second substrate that is to be located closer to the semiconductor structure; bonding the second substrate above the semiconductor structure via a bonding member; removing the first substrate from the semiconductor structure to obtain a bonded body in which the second substrate is bonded above the semiconductor structure; and singulating the bonded body.
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